Below is a screenshot of the AutoCAD text available from ATP:Īny changes to a drawing or CAD file after submission of a quote, will require a revision change and request for a re-quote.SimpleCAD is an easy, simple to learn 2D Computer Aided Design program (CAD) made to meet all of your basic design needs. This text can be used to make any part number or text required on a circuit.ġ0.3. This text is made of “closed joined polylines” and was created to work with our processing.ġ0.2. Upon request, ATP can supply our customer with down-loadable AutoCAD Text that can be used in the data that will be supplied to ATP. Follow all the preceding guidelines in section 9.5 and add the quantities of each circuit part number as shown in Figure Ten.ġ0.1. Figure Ten is an example of a Multi-circuit array (pizza). The dicing mark must be centered as shown in Figures Eight and Nine.ĩ.5.4. The stepping distance of the circuits in the array is determined by adding the dicing kerf to the circuit size. The standard border (keep out) size from the outside edge of the substrate is 0.050" (1270um).ĩ.5.3. Mask Glass Size will be determined by ATP.ĩ.5.2. Please contact ATP Sales to determine the optimum array size. Creating arrayed data is optional, but if you are providing arrayed data it should be arrayed on the substrate size optimal to the number of circuits (and size) required. When ATP fabricates the mask, the optimum array size will be determined for you. The array size depends on the circuit size and the quantity ordered. The size of the substrate used heavily influences the final cost of the circuit. The mask array determines the substrate that can be used. This is the simplest and most accurate method.ĩ.5.1.
Figure Eight shows how Dicing Marks and the array are created in CAD.
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The example shows how to array a circuit on to a 2"x2" Substrate using a. Use Figure Eight and Figure Nine as a reference for preparing and arraying data onto a substrate.ĩ.3. Please do not use Splines, Ellipses or Regions. Notes and dimensions in Paper Space are fine.Ĩ.4. No Circuit Data or Circuit layers in Paper Space.Ĩ.3. Draw all patterns using closed joined polylines. Provide a tolerance only if required for the design. Circuit patterns will come from the data provided to Cad. This section is provided to help the designer annotate a drawing. This CAD data helps the CAD Drafter understand the bottom orientation relative to the top when via holes are not present or the design is not symmetric.ħ.1. See below the screen shot of the added bottom layer to help identify the CAD Data.Ħ.3. Figure Four clearly identifies the top and bottom patterns. Double-sided circuits have patterns on the top and bottom sides.Ħ.2. Data Guidelines Two-Sided (Double-Sided) CircuitĦ.1. Figure Three (Preferred) is the same as Figure two, except the metallized, areas (resistor and gold) have been clearly identified by a “hatch” pattern. In Figure Two, each component of the design has been identified by color and layer. This is not clear and may be interpreted incorrectly.ĥ.4. Figure One shows a design that is all on one layer and one color. Please do not provide CAD data all on one layer. Please refer to ATP’s design guidelines and catalog specifications.ĥ.3. Note, some of the information below is specific to CAD software.ĥ.1. This reference identifies simple CAD rules and methods that will communicate the design.Ģ.1.1. The purpose of these guidelines is to help insure on time delivery and that each order will be built to specification.Ģ.1. To facilitate these documents, we request that you incorporate the following information and design guidelines in your CAD package so that we may accurately process your design: 1. ATP has a talented team of CAD professionals to convert your CAD designs from specification control drawings (spec drawings) into the various documents needed for thin-film processing.
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